| Model No. | | 156.75-5BB 4.52 | 156.75-5BB 4.55 | 156.75-5BB 4.57 | 156.75-5BB 4.59 | 156.75-5BB 4.62 | 156.75-5BB 4.64 | 156.75-5BB 4.67 |
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| Product Characteristics | |
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| Cell Technology | Polycrystalline |
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| Dimensions | 156.75×156.75 mm |
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| Cell Thickness | 200 ± 15 µm |
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| Front Surface (-) | |
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| No. of Busbars | 5 |
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| Busbar Width | 0.7 mm |
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| Busbar Material | Silver |
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| Anti Reflection Coating | Silicon nitride |
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| Back Surface (+) | |
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| No. of Soldering Pads | 5 |
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| Soldering Pad Width | 2 mm |
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| Soldering Pad Material | Silver |
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| Back Surface Field (BSF) | Aluminium |
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| Electrical Data at STC | |
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| Maximum Power (Pmax) | | 4.52 W | 4.55 W | 4.57 W | 4.59 W | 4.62 W | 4.64 W | 4.67 W |
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| Voltage at Maximum Power Point (Vmpp) | | 0.5371 V | 0.5395 V | 0.5389 V | 0.5422 V | 0.5443 V | 0.545 V | 0.5458 V |
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| Current at Maximum Power Point (Impp) | | 8.417 A | 8.424 A | 8.48 A | 8.473 A | 8.487 A | 8.52 A | 8.552 A |
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| Open Circuit Voltage (Voc) | | 0.6321 V | 0.6342 V | 0.6347 V | 0.637 V | 0.6387 V | 0.6399 V | 0.6407 V |
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| Short Circuit Current (Isc) | | 8.911 A | 8.913 A | 8.975 A | 8.963 A | 8.977 A | 9.006 A | 9.032 A |
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| Cell Efficiency | | 18.4-18.5 % | 18.5-18.6 % | 18.6-18.7 % | 18.7-18.8 % | 18.8-18.9 % | 18.9-19 % | 19-19.1 % |
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| Fill Factor (FF) | | 80.26 % | 80.4 % | 80.22 % | 80.46 % | 80.57 % | 80.57 % |
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